The scientists of Dagestan State University have designed and assembled a prototype of a basic unit for nanometer-scale thermal atomic layer deposition with thickness and mass gain control.

The Atomic Layer Deposition (ALD) is the most promising, consistently developed technology for depositing thin films (nanofilms). It enables the deposition of ultrathin films of various materials on almost any type of surface. The ALD is a key technology in meeting the goals of the advanced integrated circuit (IC) industry.